Descriptions DPA 6066-OC-R-B03, d:fine™ CORE 6066 Omni Headset Mic, Black, 3 pin LEMO, Headset Over-ear Microphone for Live Production and Churches The DPA 6066-OC-R-B03 feature its Subminiature Headset Microphone, its a lightweight, one-size-fits-all headset. Also,...
DPA 6066-OC-R-B03, d:fine™ CORE 6066 Omni Headset Mic, Black, 3 pin LEMO, Headset Over-ear Microphone for Live Production and Churches
The DPA 6066-OC-R-B03 feature its Subminiature Headset Microphone, its a lightweight, one-size-fits-all headset. Also, the DPA 6066-OC-R-B03 has a minimized sze omnidirectional microphone (0.12") and a cable that is terminated with a hardwired 3-pin LEMO connector. Even the DPA 6066-OC-R-B03 has a small size, it has a power of larger DPA mics. The DPA 6066-OC-R-B03 can also be used with wireless microphone systems (sold separately) to capture audio for live stage, theater, presentation and rehearsal applications.
In addition, the DPA 6066-OC-R-B03 offers a maximum comfort when attach over the ears, the DPA 6066-OC-R-B03 has a 3-point ear grips with spring mechanisms that help grip below the ears and to the side of the head for added security. Also, the DPA 6066-OC-R-B03 has a 2-way adjustable boom system-length and height-with an anti-rotate mechanisms that makes this headset very easy to fit. It has also a 90° cable management system safeguards the cable and directs it down to the wearer's back, where it can't be seen.
DPA 6066-OC-R-B03 Main Features
3mm Core by DPA capsule technology
DPA sound in a 60% smaller capsule
One-size-fits-all, headset fits securely and comfortably
2-way adjustable, non-reflective boom with locking system
Unique, comfortable 3-point gripping system above, below and behind the ear
New 90° cable management constructed to guide the cable and minimize cable breaks
IP58 Certified
Water-repellant nano-coating of the cover and housing
Hermetic sealing of the sensitive amplifier at the core of the mic
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